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01 / About Us
Company
Overview History / Timeline Newsroom
Global Presence
All Locations China Austria Benelux France Germany Israel Italy North America Scandinavia & Baltics United Kingdom Spain Switzerland
Governance & Compliance
UK & EU GDPR Modern Slavery Statement Code of Ethics Supplier Code of Conduct Whistleblower Tool
02 / Our Technologies
PCB Technologies
Standard PCBs HDI PCBs ATE PCBs Flexible & Rigid-Flex PCBs Thermal Management PCBs Radio Frequency PCBs IC Substrate PCBs Backplane PCBs
Energy Storage
Battery Energy Storage System
Integrated solutions supporting efficient, reliable and scalable energy storage.
Discover BESS
03 / Sectors
Automotive Railway Medical Energy Industrial
04 / Inside Company
Sustainability Building a more responsible future. Discover our ESG strategy, goals, reports and environmental commitments.
Explore Sustainability
News Stories, achievements and insights. Follow company developments, awards, technologies and global initiatives.
Read the latest news
Services Logistics Terms & Conditions Download
05 / Knowledge Centre
Process
PCB Manufacturing Process
Design
Layout Guidelines HDI Design Rules Multilayers: Design Rules Rigid-Flex & Flex Design Rules Optimised PCB Design Choosing Via Filling / Plugging Type
Technology
Micro Via Technology Stacked or Staggered Microvia Back Drill Technology Impedance Control in PCB Design
Materials
PCB Surface Finishes PCB Raw Materials Guide Importance of Laminate CTE Surface Finishing: Advantages & Disadvantages
Thermal
Thermal Pads in PCB Efficient Heat Dissipation Temperature Management in PCBs
Advanced
Embedded Resistors / Capacitors Technology Embedded Resistors in Printed Circuits
Rigid-Flex
Rigid-Flex PCB Total Cost of Ownership Case Study: di-soric & Rigid-Flex
Quality
How to Avoid Bow and Twist in PCB Why Do PCB Jobs Go On Hold?
Brand
The History of Printed Circuit Boards In The Spotlight
06 / Work With Us
Careers Overview Discover our culture, values and global opportunities.
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07 / Contact Us
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